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MediaTek Dimensity 7050
A rebadge with a purpose: the Dimensity 1080 relaunched as the 7050 for India's midrange, headlining the realme 11 Pro. Two Cortex-A78 cores and a Mali-G68 MC4 on 6nm make it competent rather than exciting, with a 200MP-capable ISP as the headline feature.
Pros
- 200MP camera support at a midrange price
- Mali-G68 MC4 outguns most 6nm rivals
- Proven, cool-running platform
- Wide availability in Indian midrangers
Cons
- Essentially a renamed Dimensity 1080
- 6nm process trails 4nm competitors
- Only two performance cores
Below average
Computed from specs & benchmarks via our public methodology.
Full specifications
Everything we track for the MediaTek Dimensity 7050
General
- Announced
- 2023
- Process
- 6 nm
- TDP (typical)
- 5 W
- Architecture
- Armv8.2
CPU
- Cores
- 8
- Core configuration
- 2x2.6 GHz Cortex-A78 + 6x2.0 GHz Cortex-A55
- Max clock
- 2.6 GHz
GPU
- GPU
- Arm Mali-G68 MC4
AI
- NPU
- MediaTek APU 650
Memory
- Memory type
- LPDDR5-6400
- Max bandwidth
- 51.2 GB/s
Connectivity
- Modem
- Integrated 5G modem
- Wi-Fi
- Wi-Fi 6E
- Bluetooth
- 5.2
Media
- Max display
- FHD+ @ 120Hz
- Video capture
- 4K@30fps
Benchmarks
- AnTuTu 10
- 590,000
- Geekbench 6 (single)
- 1,010
- Geekbench 6 (multi)
- 2,380
- 3DMark Wild Life Extreme
- 730
Quick answers
Is the MediaTek Dimensity 7050 good in 2026?
The MediaTek Dimensity 7050 earns an Inno Score of 34.9/100 (“Below average”) based on its specs and benchmark results. A rebadge with a purpose: the Dimensity 1080 relaunched as the 7050 for India's midrange, headlining the realme 11 Pro. Two Cortex-A78 cores and a Mali-G68 MC4 on 6nm make it competent rather than exciting, with a 200MP-capable ISP as the headline feature.
What are the key specs of the MediaTek Dimensity 7050?
Cores: 8 · Process: 6 nm · AnTuTu 10: 590,000 · GPU: Arm Mali-G68 MC4
What are the closest alternatives to the MediaTek Dimensity 7050?
Its closest rivals on InnoReviews are Qualcomm Snapdragon 4 Gen 2, Qualcomm Snapdragon 778G, Huawei Kirin 9000S — open the comparison pages for a spec-by-spec breakdown.
